Date: 20 May 2025
Time: 15:30 – 17:30 (SGT)
Venue: SEMICON SEA 2025, Sands Expo & Convention Centre, Singapore
Format: In-person | By Invitation Only | Standing networking session
Organised by: Digital Partnerships in Action (DPA), funded by the European Union
Event Overview:
As part of the EU’s strategic engagement with Southeast Asia under the Digital Partnerships in Action (DPA) initiative, Handshake@SEMICON offers a dynamic networking platform designed to foster dialogue, partnership, and investment in the global semiconductor landscape.
Taking place during SEMICON Southeast Asia 2025, this session will convene up to 80 invited participants including:
Themed “Bridging Continents, Building Future,” the event will spotlight collaboration opportunities in semiconductor R&D, resilient supply chains, and digital innovation between Europe and Asia.
Proposed Structure of the Session
1. Welcome & Opening Remarks (40 minutes)
2. Structured Networking Activity (70 minutes)
Facilitated engagement using formats below:
Focus: Encourage targeted conversations, identify shared interests, and initiate potential partnerships or MOUs.
Refreshments will be served throughout to support informal exchanges.
3. Wrap-up & Closing Remarks (10 minutes)